Bio: Ray joined MicroLink Devices in October 2008. He initially worked on methods to package the uniquely flexible and lightweight solar cells developed at MicroLink. He was the program manager for multiple DoD programs that applied these solar cells onto small hand-launched unmanned aerial vehicles (UAVs) demonstrating extension of flight endurance. Ray now works closely in support of customers with solar-powered stratospheric aerial platforms. Previously, Ray worked at TriQuint Semiconductor in Hillsboro, Oregon, where he was responsible for the development and sustaining of various sputtered metal deposition processes and electroplate activities. He was a project leader for the development and production ramp of CuSn pillar bump technologies on 150 mm and 200 mm wafers for flip-chip assembly and packaging. Ray received his B.S. and M.S. degrees in ECE from the UIUC in 1995 and 1996.